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Flash Memory Summit 2015
From the 11th to the 13th of August 2015, the Flash Memory Summit 2015 took place in Santa Clara, California (USA). Every year experts from around the globe meet here to present, discuss and analyze the latest flash memory innovations, trends and future visions. Hagen Schmidt, CDA’s Director of Product Management Flash Media Solutions, was there and personally experienced how Samsung and Intel stirred up the industry with their breakthrough innovations.

Fast. Faster. Fastest.

Real and virtual worlds continue to merge into “Internet of Things” (IoT).  The “Smart Factories” of industry 4.0 are completely networked, automated solutions have become increasingly complex and intelligent all-purpose robots conquer production halls. Even in everyday life, artificial intelligence has arrived. The coming of self-driving cars is no longer a question. The only question is when? Already today smart machines work in hotels, help the elderly in nursing homes and tally up purchases in supermarkets.

A Gigantic Market
With the advance of the digital revolution in the fields of automation and robotics, a gigantic market has emerged – a market that needs new storage solutions for permanent, fast and secure exchange of unbelievable amounts of data. While until recently it was enough to duplicate information on optical media such as CDs or DVDs, today there is no way around flash memory products – and the same goes for more “estab-
lished” applications. It is state-of-the-art to store navigational data on SD cards, car infotainment systems on SDDs or embedded solutions, and manuals on USB sticks in order to flexibly and securely use these around the world – or to implement USB sticks as workshop media for timely system updates.

Revolutionary Memory Technologies
What makes the flash memory market even more fit for the future – that was a topic at the recent Flash Memory Summit 2015 in Santa Clara (USA). Two “big players” displayed their new storage technologies that are helping to shape the current industrial revolution.

Together with its cooperation partner Micron Technology, Intel displayed their new super memory: 3D XPoint – pronounced “cross point”. This new memory technology combines the advantages of non-volatile memory (NVM) and random access memory (RAM). The data is not traditionally stored by means of transistors such as with NAND flash, but by changing the resistance of the memory cells. 3D XPoint should be up to 1000 times faster than conventional NAND flash storage and at the same time 1000 times more durable with an up to 10 times higher storage density.  

The second innovation comes from Korea and has already gone into mass production. It is the first up to 128 GB embedded flash memory chips with UFS 2.0 standard, from Samsung. Universal Flash Storage (UFS) offers fantastic advantages. It reaches up to 2.7 times more speed in comparison to standard EMMC storage. Records of 19,000 input/output operations per second are possible. The new memory modules based on UFS 2.0 will be produced in size ranges of 32, 74 and 128 GB and are suitable, according to statements from Samsung, especially for high-end mobile devices such as smartphones and tablets. Nevertheless, an extension of the application field is only a matter of time.

However the brand new flash memory products develop on the market, one thing is certain: CDA will be among the “early adopters” of innovative new products and will rigorously scrutinize them. Because the future of flash mem-ory shapes the world of tomorrow – and data duplication on flash memory products is CDA’s core business today!

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